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Alumina ceramic substrate processed by infrared laser

Release time: 2020-03-19 17:25:31 browsing times:

[ alumina ceramic Infrared laser processing Alumina ceramic substrate
    

Introduction of ceramic substrates

Ceramic substrate, also known as Ceramic substrate The electronic ceramic is used as a substrate to form a sheet material supporting the base for the membrane circuit elements and the external components.

Ceramic substrate has the advantages of high temperature resistance, high electrical insulation, low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficient of components. But the ceramic substrate is crisp, and the substrate area is small and the cost is high.

Ceramic substrates have the following advantages:

1, good insulation performance and high reliability.

2, the dielectric coefficient is small and the high frequency characteristic is good.

3, thermal expansion coefficient is small, thermal mismatch rate is low.

4. High thermal conductivity.

Two

Machining difficulties of traditional ceramic substrates

The traditional processing methods of ceramic substrates are mainly divided into two types, namely, molding and machining (vehicle, milling, drilling, grinding, etc.).

Molding method: The ceramic powder is mixed with plasticizer and poured into the abrasive tool, and the pressure is applied. Only a simple ceramic substrate can be produced, and the production efficiency is not high and the production cycle is long. This method is basically eliminated when making ceramic substrates, and is now mainly used for making ceramic substrates.

Machining: Due to the high hardness, brittleness and fragility of ceramic materials, traditional machining is difficult. However, traditional machining can basically meet the production of ceramic substrates, but the machining efficiency is low, the yield is not high, and the processing loss is large.

Three

Advantages and choices of laser processing

The advantages of laser processing are:

1. Laser processing is non-contact processing, with high cutting accuracy and controllable depth.

2, processing graphics arbitrary editing, CAD drawings can be imported, no need to mold, production cycle is short;

3, the processing quality is high, no burrs, no collapse;

4, processing speed is fast, processing cost is low;

5, precision machining can be realized, small holes with 0.15mm diameter can be machined, and less processing waste.

Laser processing mainly uses CO2 laser and QCW pulse laser.

CO2 laser: Alumina ceramic chip has high laser absorptivity for CO2 laser, but because of its large spot, it can not cut small graphics and wide linewidth, and its processing efficiency is lower than that of QCW laser.
 Ceramic grading wheel.Jpg Laser: The QCW pulsed laser is an optical fiber laser with a wavelength of 1070nm. The absorbance of alumina ceramics for 1070nm wavelength is about 25%, but because of its high beam quality, the spot is smaller than that of CO2 laser. So compared to the CO2 laser, its cutting speed is fast, it can cut small graphics, and its efficiency is higher than that of CO2 laser.

Source: Http://bjyjpf.cn
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